Phenolic resin 1101 is a general-purpose thermosetting resin, featuring high temperature resistance and high strength. It differs from previous rubber additives and is mainly used for rubber reinforcement, composite material bonding, mold forming, etc. It is made from phenol and formaldehyde as the core raw materials through a condensation reaction and is a light yellow to brownish red transparent solid. It has no obvious odor, high hardness and good toughness. After curing, its performance is stable and it can be adapted to various processing methods, and is widely used in the rubber, machinery, and electronics industries.
Product parameters
| Appearance | Light yellow to brownish red transparent solid |
| Softening temperature | 85-95℃ |
| Hydroxymethyl content | 8-12% |
| Free phenol content | ≤ 3.0% |
| Weight loss (105℃) | ≤ 1.0% |
| Viscosity (150℃) | 50-150 mPa· |
Product advantages
It has outstanding high-temperature resistance, and can be used for a long time at temperatures below 150℃ without deformation or aging. It has high mechanical strength, which can significantly enhance the hardness and impact resistance of rubber and composite materials. It has strong adhesion and can be used as an adhesive, suitable for various substrates. The curing speed is moderate, the processing is convenient, and it is suitable for various processes such as molding and pouring. It has good chemical resistance, can resist the erosion of acids, alkalis, and solvents, has a high cost-performance ratio, and is suitable for mid-to-high-end processing scenarios.
Services
Standard 25kg sealed woven bag packaging, custom small-sized samples available; stable in stock, supports bulk purchase and small batch trial use, bulk purchase enjoys discounts; provides complete quality inspection report, assists in debugging and stabilizing process parameters; responds promptly to after-sales service, answers practical questions such as storage, usage and formula compatibility.
FAQ
Q: Where is phenolic resin 1101 mainly used?
A: It is mainly used in rubber reinforcement, composite material bonding, mold forming, electronic component packaging, etc.
Q: What conditions are required for curing?
A: Generally, it needs to be heated at 120-150℃ for curing. It can be used with curing agents to shorten the curing time.
Q: What are the storage requirements?
A: Store it sealed in a cool and dry place, away from high temperatures, fire sources, and avoid moisture and caking. The shelf life is 12 mon
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